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Silicone Electronic Potting Compound , Excellent Potting Compound For Pcb

Hunan LEED Electronic Ink Co., Ltd
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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Silicone Electronic Potting Compound , Excellent Potting Compound For Pcb

Brand Name : LEED-INK
Model Number : EG-FXXX series
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Supply Ability : 500000KG per month
Delivery Time : within 7 days after payment confirmed
Packaging Details : 1KG/Plastic can, 5KGS/Plastic bucket, and 25KGS/Plastic bucket
Mixing Ratio : 1:1
Color : Red
Heating Curing Time (h) : 100℃/15min
Operating Temperature (℃) : -50℃-250℃
Thermal Conductivity (W/m.K) : 0.8 / 2.6
Room Temperature Curing Time (h) : 24H
Hardness (shore A) : 42-60
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Excellent High & Low Temperature Resistance Two Component Silicone Potting Compound


LEED-INK two-part thermally conductive silicone encapsulant and potting compound for electronics is manactured by full-automatic producrtion line.

It has the properties of thermal shock resistance,excellent electric properties,and low water absorption.They have deep hardening performance,and high bond strength to coherer,alloy,ceramic,glass or plastic surfaces.


  • Two-part; thermally conductive, room temperature or heat cure
  • Minimal shrinkage
  • No exotherm during cure
  • No solvents or cure by-products; deep section cure
  • Good dielectric properties
  • Cures to a flexible elastomer


Mixing Ratio1:11:1

Viscosity (Pa.S)

(Brookfield HBT,10rpm,25℃)


Room Temperature
Operable Time (h)


Room Temperature
Curing Time (h)

Heating Curing Time (h)100℃/15min100℃/15min
Density (g/cm3)2.541.50
Hardness (shore A)6042
Operating Temperature (℃)-50℃-250℃-50℃-250℃
Thermal Conductivity (W/m.K)2.600.80
Volume Resistance (Ω·cm)10141014


1) Component A and component B should use special tools separately. Do not use the tools in mixture.
2) Separately stir component A and component B fully and evenly before using.
3) Mix according to A:B=1:1, and stir it over 15min to ensure the mixing uniformity of component A and B.
4) After mixing, deaerate the paste in vacuum equipment with 10min before potting. To ensure the potting quality, it is recommended to deaerate again after potting. If no deaeration, please put the product with 30min in room temperature before heating and curing.
5) Please finish 3) and 4) within operating time(8h).
6) Curing could be done by 80℃/15min, or 24h in room temperature.


The general package is 1KG/Plastic can, 5KGS/Plastic bucket, and 25KGS/Plastic bucket.

Why Choose Us?

1. LEED-INK has a deep know-how and a strengthened experience linked to the development, production and use of thermal conductive materials for a great variety of applications.

2. Ensure product with high quality and pre-commissioning before delivery.

3. Fastest delivery: Sample order in stock and 3-7 days for mass production.

4. Dedicated to high quality, stable supply and considerate service.

5. Accept low order quantity. Easy to make a test for all customers.


Q1: Are you trade company or manufacturer?
We are China professional manufacturer of customizing various thermal interface materials for years experience in this line.

Q2: Can you provide OEM or ODM service?
Surely we can. We have a professional team which has rich experience in silicone sealant field. You can also design your logo,packaging and other details.If the existing products can meet your requirements, we can provide you with customized service.

Q3: Can i take sample?
Yes,we are honored to provide you sample. 1~2PCS and 50~100ML/PCS ,Free sample and Customer bear the freight.

Q4: What payment term is available?
We can accept Paypal, TT, Western Union.

Q5: What's the lead time?
1~3 days for sample ,5~7 workdays for mass order.

Product Tags:

electronic potting compound


electronic potting silicone

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