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Ceramic Thick Film Circuits Electrically Conductive Paste 12 - 16μM Fired Thickness

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Hunan LEED Electronic Ink Co., Ltd
City: Zhuzhou
Province/State: Hunan
Country/Region: China
Tel: 86-731-22976365

Ceramic Thick Film Circuits Electrically Conductive Paste 12 - 16μM Fired Thickness

Brand Name : LEED-INK
Model Number : DT5501
Certification : ISO9001, ISO14001, SGS, ROHS
Place of Origin : China
MOQ : 1KG
Price : Negotiable
Payment Terms : L/C, T/T, Western Union, Paypal
Supply Ability : 30000KG per month
Delivery Time : within 7 days after payment confirmed
Packaging Details : 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG / carton
Ag Content (%) : 80
Fineness(μm) : <12
Drying : 120-150℃/ over 8min
Firing : 550℃/ over 10min
Fired Thickness(μm) : 12-16
Conductivity(mΩ/sq) : ≤3
Solder Resistance (times) (235°C, 10s, PbSn Solder) : ≥2
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Good Solderability Electrically Conductive Paste for Ceramic Thick Film Circuits


Description


The silver paste DT5501 is for the general-purpose and with a lower firing temperature, usually in the 500-550 ℃ can be fired for the need for lower sintering temperature of the circuit, the sensor and electronic components electrode.

The silver paste also has excellent electrical conductivity, reliable adhesion, in line with the latest environmental requirements, non-toxic, non-harmful organic matter. It is a high cost efficiency silver paste.


Application


  • Ceramic Thick Film Circuits
  • GPS Dielectric Rod Antennas
  • Thick Film Heaters
  • Chip Component
  • Ozonator

Specification


Test


DT5501


Ag Content (%)

80

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

120-150℃/ >8min

Recommended Firing Conditions

550℃/ >10min

Fired Thickness(μm)

14±2

Conductivity(mΩ/sq)

≤3

Welderability

Excellent

Solder Resistance (times)

(235°C, 10s, PbSn Solder)

≥2

Adhesion/ Tape Pull

(3M Scotch Tape #600)

No Ag Transfer

Adhesion((N/2×2mm2)

≥20

Thinner

LEED DZ-XS

Shelf Life

Six Months

from Date of Shipment


Advantage


  • Strong Adhesion
  • Good Solderability
  • Excellent Ageing Resistance
  • Good Conductivity

Related Products Properties


Test


Properties



DT5501



DT5502



DT5503



DT5504



DT5505


Ag Content (%)

8075706560

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325

Leveling Time

At room temperature, 2-3 min

Recommended

Drying Conditions

120℃-150℃/>8min

Recommended

Firing Conditions

550℃/>10min

Film Thickness (μm)

12-16

Conductivity (mΩ/sq)

≤ 3

≤ 3

≤ 4

≤ 4

≤ 5

Welderability

Excellent

Excellent

Good

Good

Good

Soldering Resistance (times)

(235℃, 10s, PbSn Solder)

≥2

Adhesion((N/2×2mm2)

≥20

Shelf Life200±30

Six Months from Date of Shipment


Why Choose Us?


1. Any inquiries will be replied within 24 hours.


2. High-quality products and the most reasonable price.


3. Superior testing equipment, simulate clients’ real feel, ensure every products meet customers

real production requirement

4. Superior testing equipment, simulate clients’ real feel, ensure every products meet customers real production requirement.


5. To follow orders and arrange shipping in time, providing complete documents for Customs clearance according to different export policies in different countries.


Product Tags:

electrical conducting paste

      

thermal conducting paste

      
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Ceramic Thick Film Circuits Electrically Conductive Paste 12 - 16μM Fired Thickness Images

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